Intel and Micron announce its partnership in an effort to improve 3D XPoint Technology of an entirely new class of non-volatile memory that Intel uses on its solid-state drive products. The next-generation 3D XPoint Technology is expected to have lower latency, greater endurance that NAND flash memory and at a more affordable cost. Intel and Micron expects to complete the development of the second-generation 3D XPoint Technology in the first half of 2019 and optimized the technology for their respective products and business applications. The two companies will continue to manufacture memory based on 3D XPoint technology at the Intel-Micron Flash Technologies (IMFT) facility in Lehi, Utah.

"Micron has a strong track record of innovation with 40 years of world-leading expertise in memory technology development, and we will continue driving the next generations of 3D XPoint technology. We are excited about the products that we are developing based on this advanced technology which will allow our customers to take advantage of unique memory and storage capabilities. By developing 3D XPoint technology independently, Micron can better optimize the technology for our product roadmap while maximizing the benefits for our customers and shareholders." - Scott DeBoer, executive vice president of Technology Development at Micron.

"Intel has developed a leadership position delivering a broad portfolio of Optane products across client and data center markets with strong support from our customers. Intel Optane's direct connection to the world's most advanced computing platforms is achieving breakthrough results in IT and consumer applications. We intend to build on this momentum and extend our leadership with Optane, which combined with our high-density 3D NAND technology, offer the best solutions for today's computing and storage needs." - Rob Crooke, senior vice president and general manager of Non-Volatile Memory Solutions Group at Intel Corporation.

Learn more about Intel’s solid-state drive line-up here.